The global thermal interface materials market size reached approximately USD 4.35 Billion in 2025. The market is projected to grow at a CAGR of 10.10% between 2026 and 2035, reaching a value of nearly USD 11.39 Billion by 2035.
Base Year
Historical Period
Forecast Period
Compound Annual Growth Rate
10.1%
Value in USD Billion
2026-2035
*this image is indicative*
| Thermal Interface Materials Market Report Summary | Description | Value |
| Base Year | USD Billion | 2025 |
| Historical Period | USD Billion | 2019-2025 |
| Forecast Period | USD Billion | 2026-2035 |
| Market Size 2025 | USD Billion | 4.35 |
| Market Size 2035 | USD Billion | 11.39 |
| CAGR 2019-2025 | Percentage | XX% |
| CAGR 2026-2035 | Percentage | 10.10% |
| CAGR 2026-2035 - Market by Region | Asia Pacific | 11.6% |
| CAGR 2026-2035 - Market by Country | India | 13.4% |
| CAGR 2026-2035 - Market by Country | China | 11.2% |
| CAGR 2026-2035 - Market by Product | Phase Change Materials | 11.4% |
| CAGR 2026-2035 - Market by Application | Automotive Electronics | 11.3% |
| Market Share by Country 2025 | Japan | 4.2% |
Thermal interface materials refer to materials used for improving and dissipating heat transfer from electronic devices. They are found between the dissipating device and the heat-generating component. Thermal interface materials enhance the thermal coupling between the components they are placed, reduce the thermal boundary resistance, and improve the thermal management performance.
The EMR’s report titled “Thermal Interface Materials Market Report and Forecast 2026-2035” offers a detailed analysis of the market based on the following segments:
Market Breakup by Product
Market Breakup by Application
Market Breakup by Region
| CAGR 2026-2035 - Market by | Country |
| India | 13.4% |
| China | 11.2% |
| UK | 11.1% |
| USA | 10.8% |
| Germany | 10.0% |
| Canada | XX% |
| France | XX% |
| Italy | XX% |
| Japan | 7.0% |
| Australia | XX% |
| Saudi Arabia | XX% |
| Brazil | XX% |
| Mexico | XX% |
Consumer electronics are projected to account for a significant portion of the thermal interface materials market in upcoming years due to the high demand for consumer electronics by the emerging middle-class population. Thermal interface materials are widely used to provide a high thermal conductivity path between heat-sinking elements and heat-generating components in consumer electronics.
The Asia Pacific is anticipated to witness a healthy growth in the market for thermal interface materials over the forecast period owing to the rapid industrialisation and urbanisation in the region. Additionally, the rising demand for consumer electronics in the region is also expected to aid the market expansion in the coming years.
The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the thermal interface materials market, covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.
The 3M Company is an industrial machinery manufacturing company that was founded in 1902 and is headquartered in Minnesota, the United States. It applies innovation and science to offer long lasting, innovative, and durable products.
DuPont de Nemours, Inc is an industrial machinery manufacturing company that was established in 2017 and is based in Delaware, the United States. It specialises in next generation automotive and industrial technologies, among others.
Honeywell International, Inc. is an appliance, electrical, and electronics manufacturing company that was founded in 1906 and is headquartered in North Carolina, the United States. It primarily focuses on performance technologies and materials, and building technologies, among others.
*Please note that this is only a partial list; the complete list of key players is available in the full report. Additionally, the list of key players can be customized to better suit your needs.*
Other players in the thermal interface materials market include Indium Corporation, Parker Chomerics, Laird Technologies, Inc., Momentive Performance Materials Inc., Fuji Polymer Industries Co., Ltd., Shin-Etsu Chemical Co. Ltd., Wakefield Thermal, Inc., and Sekisui Polymatech Co Ltd, among others.
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*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*
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The market reached a value of approximately USD 4.35 Billion in 2025.
The market is assessed to grow at a CAGR of 10.10% between 2026 and 2035.
The market is estimated to witness a healthy growth in the forecast period of 2026-2035 to reachnearly USD 11.39 Billion by 2035.
The major market drivers include rising technological advancements in the electronics sector and growing demand for consumer electronics.
The key trends fuelling the growth of the market include increasing sales of consumer electronics, electronic product innovations, and growing demand for miniaturised electronic devices.
The major regions in the market are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
Silicone sheet loaded with thermal conductive particles is the thermal interface material used in CPUs.
The various products considered in the market report include greases and adhesives, tapes and films, elastomeric pads, phase change materials, and metal based, among others.
The significant applications of thermal interface materials include automotive electronics, telecom, desktop computer, laptops and handheld devices, medical devices, industrial machinery, and consumer electronics, among others.
The key players in the global thermal interface materials market are The 3M Company, DuPont de Nemours, Inc, Honeywell International, Inc., Indium Corporation, Parker Chomerics, Laird Technologies, Inc., Momentive Performance Materials Inc., Fuji Polymer Industries Co., Ltd., Shin-Etsu Chemical Co. Ltd., Wakefield Thermal, Inc., and Sekisui Polymatech Co Ltd, among others.
Explore our key highlights of the report and gain a concise overview of key findings, trends, and actionable insights that will empower your strategic decisions.
| REPORT FEATURES | DETAILS |
| Base Year | 2025 |
| Historical Period | 2019-2025 |
| Forecast Period | 2026-2035 |
| Scope of the Report |
Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:
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| Breakup by Product |
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| Breakup by Application |
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| Breakup by Region |
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| Market Dynamics |
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| Competitive Landscape |
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| Companies Covered |
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