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Report Overview

2024

Base Year

2018-2024

Historical Year

2025-2034

Forecast Year

Global Printed Circuit Heat Exchanger Market Outlook

The global printed circuit heat exchanger market is expected to grow at a CAGR of 4.60% between 2025 and 2034. Key market drivers are its properties like lightweight, efficient performance, improved safety, and need for less space for operations. 

Key Trends in the Market

Printed circuit heat exchangers are compact and robust heat exchangers that are primarily based on chemical etching and diffusion bonding technologies and are used for processing heat transfers. They can be used for various processing applications that need high efficiency and performance and also handle a wide variety of clean fluids. It is known for its properties such as high number of transfer units, robustness, and compactness.

  • Growing industrialisation in the developing regions is increasing the use and demand for the printed circuit heat exchangers which are widely used for cooling and heating purposes in various industries.
  • There is increasing demand for efficient heat energy technology owing to its economic advantages such as independence from additional equipment to operate and environmental advantages such as use of less energy and production of no or little pollution. This has largely contributed to the growth of the printed circuit heat exchanger market.
  • Technological advancements and innovations such as diffusion bonded PCHEs provide improved heat transfer and have proved to perform better in extreme pressure and temperature, and corrosive environments. These improved printed circuit heaters are gaining in popularity as compared to traditional heat exchangers.

Market Analysis

Based on materials, the printed circuit heat exchanger market can be divided into steel and stainless steel, aluminium, nickel and nickel-based alloys, copper, and titanium and titanium alloys, among other materials. On the basis of technology, the market is bifurcated into chemical etching and diffusion bonding. Based on application, the market is categorised into chemical processing, oil and gas, power generation, and industrial, among others. By region, the market is divided into North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. 

The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the global printed circuit heat exchanger market covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.

  • Kobe Steel, Ltd.
  • HEXCES
  • Kelvion Holding GmbH
  • Meggitt PLC
  • Alfa Laval Inc.
  • DongHwa Entec Co., Ltd.
  • Tanktech Co., Ltd.
  • Precision Micro Ltd.
  • VPE Thermal LLC
  • Others

Market Share by Material

Stainless steel is increasingly used to make printed circuit heat exchangers, due to which it is projected to account for a substantial share in the printed circuit heat exchanger market. They usually are made of 300 series stainless steel because of the wide range of advantages offered. 

Properties of stainless steel such as its ability to operate effectively in both hot and cold temperatures without sustaining damage is a major factor helping in the growth of the stainless-steel segment in the market. They also allow PCHEs to work with heavy industrial machinery that produce large amounts of heat without influencing performance.

Market Share by Region

North America is expected to hold a larger share in the printed circuit heat exchanger market because of the increasing demand from industries such as petrochemicals, oil and gas, and chemicals. Initiatives and undertakings by governments such as projects as a part of high intensity thermal exchange in the North American region is also helping in the growth of the overall market. 

Europe is also expected to observe a significant rise in the market owing to the extensive use of printed circuit heat exchangers in the chemical industries and refineries. 

Competitive Landscape

Kobe Steel Ltd. is a steel manufacturing company which supplies aluminium and copper products. Its other business segments also provide wholesale supply of machinery, electronics materials, construction machinery, real estate, and other products all around the globe. It has its headquarter in Hyogo, Japan and was founded in 1905. 

Kelvion Holding GmbH was established in 1920 and is headquartered in Bochum, Germany. It is a machinery manufacturing company that supplies plate heat exchangers, finned tube heat exchangers, refrigeration heat exchangers, shell and tube heat exchangers, and modular cooling tower systems. It caters to various end-users such as oil and gas, data centres, refrigeration, energy, chemical companies, food and beverage companies, and various others. 

Meggitt PLC was founded in 1947 and is based in the United Kingdom. It is an aviation component manufacturing company that manufactures heat exchangers, sub-systems, and components for defence, energy, aerospace, transportation, oil and gas, and other selected energy markets.  They believe in delivering solutions for challenging environments and winning the trust and heart of their customers.  

Other market players include HEXCES, Alfa Laval Inc., DongHwa Entec Co., Ltd., Tanktech Co., Ltd., Precision Micro Ltd., and VPE Thermal LLC, among others.

Key Highlights of the Report

REPORT FEATURES DETAILS
Base Year 2023
Historical Period 2018-2024
Forecast Period 2025-2034
Scope of the Report

Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:

  • Materials
  • Technology
  • Application
  • Region
Breakup by Materials
  • Steel and Stainless Steel
  • Aluminium
  • Nickel and Nickel Based Alloys
  • Copper
  • Titanium and Titanium Alloys
  • Others
Breakup by Technology
  • Chemical Etching
  • Diffusion Bonding
Breakup by Application
  • Chemical Processing
  • Oil and Gas
  • Power Generation
  • Industrial
  • Others
Breakup by Region
  • North America
    • United States of America 
    • Canada
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • ASEAN
    • Australia
    • Others
  • Latin America
    • Brazil
    • Argentina
    • Mexico
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • United Arab Emirates
    • Nigeria
    • South Africa
    • Others
Market Dynamics
  • SWOT Analysis
  • Porter's Five Forces Analysis
  • Key Indicators for Demand
  • Key Indicators for Price
Competitive Landscape
  • Market Structure
  • Company Profiles
    • Company Overview
    • Product Portfolio
    • Demographic Reach and Achievements
    • Certifications
Companies Covered
  • Kobe Steel, Ltd.
  • HEXCES
  • Kelvion Holding GmbH
  • Meggitt PLC
  • Alfa Laval Inc.
  • DongHwa Entec Co., Ltd
  • Tanktech Co., Ltd.
  • Precision Micro Ltd.
  • VPE Thermal LLC,
  • Others

*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*

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Key Questions Answered in the Report

The global market for printed circuit heat exchangers is expected to grow at a CAGR of 4.60% between 2025 and 2034.

The major market drivers include the increasing demand for efficient heat energy technology and the properties of printed circuit heat exchangers such as lightweight, efficient performance, improved safety, and less need for space for operations.

The key trends of the market are growing industrialisation, technological advancement, and wider applications of printed circuit heat exchangers.

The key market players include Kobe Steel, Ltd., HEXCES, Kelvion Holding GmbH, Meggitt PLC, Alfa Laval Inc., DongHwa Entec Co., Ltd., Tanktech Co., Ltd., Precision Micro Ltd., and VPE Thermal LLC, among others.

Printed circuit heat exchangers are compact and robust heat exchangers that are primarily based on chemical etching and diffusion bonding technologies and are used for processing heat transfers.

The primary applications of printed circuit heat exchangers are chemical processing, oil and gas, power generation, and industrial, among others.

The global printed circuit heat exchanger market is segmented based on materials, technology, application, and region.

Printed circuit heat exchanger properties are a high number of transfer units, robustness, and compactness.

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