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Report Overview

The global PCB laminate market size reached nearly USD 15.91 Billion in 2025. The market is projected to grow at a CAGR of 4.60% between 2026 and 2035 to reach a value of around USD 24.95 Billion by 2035.

2025

Base Year

2019-2025

Historical Period

2026-2035

Forecast Period

Compound Annual Growth Rate

4.6%

Value in USD Billion

2026-2035


*this image is indicative*

Global PCB Laminate Market Report Summary Description Value
Base Year USD Billion 2025
Historical Period USD Billion 2019-2025
Forecast Period USD Billion 2026-2035
Market Size 2025 USD Billion 15.91
Market Size 2035 USD Billion 24.95
CAGR 2019-2025 Percentage XX%
CAGR 2026-2035 Percentage 4.60%
CAGR 2026-2035 - Market by Region Asia Pacific 5.5%
CAGR 2026-2035 - Market by Country Saudi Arabia 5.2%
CAGR 2026-2035 - Market by Country Japan 5.1%
CAGR 2026-2035 - Market by Material Epoxy Resin 5.1%
CAGR 2026-2035 - Market by Application Consumer Electronics 4.9%
Market Share by Country 2025 Mexico 3.2%

Key Trends in the Market

PCB laminate refers to a non-conductive substrate which is used as a base material to manufacture printed circuit boards (PCBs). PCBs are used to produce various types of electronic devices such as computers and smartphones.

  • One of the PCB laminate market trends includes the heightened usage of smartphones, boosting the use of PCB laminates as base materials. The development of 5G infrastructure and advancements in data transmission technology are further escalating the incorporation of PCB laminates in smartphones.
  • The emergence of next-generation PCB laminates which are considered high-quality and affordable solutions for satellite communication and 5G RF applications is likely to support the PCB laminate market demand in the forecast period.
  • Growing research and innovations by leading consumer electronic manufacturers aimed towards improving performance, facilitating miniaturisation, and reducing the complexity of consumer electronics are likely to create growth opportunities for the market in the coming years.

Market Segmentation

“Global PCB laminate market and forecast 2026-2035” offers a detailed analysis of the market based on the following segments:

Market Breakup by Substrate Type

  • Flexible Circuits
  • HDI/Microvia/Build-Up
  • IC Substrate
  • Rigid 1-2 Sided
  • Rigid Flex
  • Standard Multilayers
  • Others

Market Breakup by Material

  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Others

Market Breakup by Application

  • Communications
  • Consumer Electronics
  • Computer/Peripheral
  • Military/Aerospace
  • Industrial Electronics
  • Automotive
  • Others

Market Breakup by Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa
CAGR 2026-2035 - Market by Material
Epoxy Resin 5.1%
Kraft Paper 4.4%
Glass Fabric XX%
Others XX%
CAGR 2026-2035 - Market by Application
Consumer Electronics 4.9%
Military/Aerospace 4.4%
Communications XX%
Computer/Peripheral XX%
Industrial Electronics XX%
Others XX%
CAGR 2026-2035 - Market by Region
Asia Pacific 5.5%
Latin America 4.4%
North America XX%
Europe XX%
Middle East and Africa XX%
CAGR 2026-2035 - Market by Country
Saudi Arabia 5.2%
Japan 5.1%
Australia 4.9%
Canada 4.3%
Mexico 4.3%
USA XX%
UK XX%
Germany XX%
France XX%
Italy 3.4%
China XX%
India XX%
Brazil XX%

Market Share by Substrate Type

Standard multilayers account for a significant portion of the PCB laminate market share. This can be attributed to the heightened application of standard multilayers in electronic products with complex systems. In addition, standard multilayers are lightweight, durable, and smaller in size compared to their counterparts, making them preferable in various end-use sectors.

Moreover, such multilayers require a single connection point, instead of multiple, which reduces the complexity of downstream electronic products.

Market Share by Region

As per the PCB laminate market analysis, the Asia Pacific is expected to experience a healthy growth in the forecast period. The rising demand for electronic products is driving the growth of the market. This region is one of the largest PCB producers around the world and is currently focussing on enabling foreign PCB manufacturing companies to build new production plants in countries like Thailand.

2025 Market Share by Country
Mexico 3.2%
USA XX%
Canada XX%

Competitive Landscape

The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the key players in the global PCB laminate market, covering their competitive landscape and latest developments like mergers, acquisitions, investments and expansion plans.

Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd. is a leading appliance manufacturing company that was founded in 1969 and is headquartered in Suwon-si, South Korea. The company manufactures a variety of consumer electronics, including smartphones, refrigerators, and TVs, among others.

ippon Mektron, Ltd.

Nippon Mektron, Ltd. is a corporation which manufactures and sells electronic products and devices, such as single-sided and double-sided circuit boards. The company was founded in 1969 and is a subsidiary of NOK Corporation.

Candor Circuit Boards

Candor Circuit Boards is a prominent circuit board manufacturer which produces flexible and rigid-flex printed circuit boards, impedance-controlled boards, heavy copper circuit boards, and metal-backed copper boards, among others.

*Please note that this is only a partial list; the complete list of key players is available in the full report. Additionally, the list of key players can be customized to better suit your needs.*

Other PCB laminate market players include Zhen Ding Technology Holding Limited, Unimicron Technology Corp., Young Poong Electronics Co., Ltd., Avanti Circuits, PCB Power/Circuit Systems India Ltd, Ventec International Group, and Venture Electronics, among others.

*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*

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Key Questions Answered in the Report

The market reached a value of nearly USD 15.91 Billion in 2025.

The market is estimated to grow at a CAGR of 4.60% between 2026 and 2035.

The market is estimated to witness a healthy growth in the forecast period of 2026-2035 to reach a value of around USD 24.95 Billion by 2035.

The heightened usage of smartphones, the rising application of standard multilayers in electronic products with complex systems, and the emergence of next-generation PCB laminates are the major drivers of the market.

The key trends in the market include the growing research and innovations by leading consumer electronic manufacturers and the increasing PCB manufacturing in countries like Thailand.

Flexible circuits, HDI/microvia/build-up, IC substrate, rigid 1-2 sided, rigid flex, and standard multilayers, among others, are the different substrate types of PCB laminates.

Glass fabric, epoxy resin, and kraft paper, among others, are the various materials of PCB laminates.

PCB laminates possess properties such as low dielectric constant, heat resistance, low dissipation factors, and high thermal conductivity, among others.

Samsung Electronics Co., Ltd., Nippon Mektron, Ltd., Candor Circuit Boards, Zhen Ding Technology Holding Limited, Unimicron Technology Corp., Young Poong Electronics Co., Ltd., Avanti Circuits, PCB Power/Circuit Systems India Ltd, Ventec International Group, and Venture Electronics, among others, are the key market players.

Report Summary

Explore our key highlights of the report and gain a concise overview of key findings, trends, and actionable insights that will empower your strategic decisions.

Key Highlights of the Report

Please note that the figures mentioned in the description serve as estimates and may vary from the actual figures presented in the final report.

REPORT FEATURES DETAILS
Base Year 2025
Historical Period 2019-2025
Forecast Period 2026-2035
Scope of the Report

Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:

  • Substrate Type
  • Material
  • Application
  • Region
Breakup by Substrate Type
  • Flexible Circuits
  • HDI/Microvia/Build-Up
  • IC Substrate
  • Rigid 1-2 Sided
  • Rigid Flex
  • Standard Multilayers
  • Others
Breakup by Material
  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Others
Breakup by Application
  • Communications
  • Consumer Electronics
  • Computer/Peripheral
  • Military/Aerospace
  • Industrial Electronics
  • Automotive
  • Others
Breakup by Region
  • North America
    • United States of America 
    • Canada
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • ASEAN
    • Australia
    • Others
  • Latin America
    • Brazil
    • Argentina
    • Mexico
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • United Arab Emirates
    • Nigeria
    • South Africa
    • Others
Market Dynamics
  • SWOT Analysis
  • Porter's Five Forces Analysis
  • Key Indicators for Demand
  • Key Indicators for Price
Competitive Landscape
  • Market Structure
  • Company Profiles
    • Company Overview
    • Product Portfolio
    • Demographic Reach and Achievements
    • Certifications
Companies Covered
  • Samsung Electronics Co., Ltd.  
  • Nippon Mektron, Ltd. 
  • Candor Circuit Boards 
  • Zhen Ding Technology Holding Limited  
  • Unimicron Technology Corp. 
  • Young Poong Electronics Co., Ltd. 
  • Avanti Circuits 
  • PCB Power/Circuit Systems India Ltd 
  • Ventec International Group 
  • Venture Electronics  
  • Others

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