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Report Overview
2023
Base Year
2018-2023
Historical Year
2024-2032
Forecast Year
Global Flip Chip Market Size
The global flip chip market reached approximately USD 31.37 billion in 2023. The market is projected to grow at a CAGR of 6.1% between 2024 and 2032, reaching a value of around USD 53.34 billion by 2032.
Flip Chip Market Outlook
- The need for smaller, more powerful electronic devices is a significant driver of flip chip technology.
- Innovations in materials, bumping processes, and packaging techniques are driving the adoption of flip-chip technology.
- The Asia Pacific region, with its strong semiconductor manufacturing base, plays a pivotal role in the global flip chip market.
Flip Chip Market Report Snapshots
Flip Chip Market Regional Analysis
*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*
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Key Questions Answered in the Report
The global flip chip market attained a value of nearly USD 31.37 billion in 2023.
The market is projected to grow at a CAGR of 6.1% in the forecast period of 2024-2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 53.34 billion by 2032.
The major market drivers include the growing demand for low-cost and miniature silicon packaging in electronic devices and the rising penetration of advanced packaging solutions in electronics.
The growing utilisation of copper pillar bumping technology and increasing R&D activities by leading companies are the key trends fuelling the market growth.
The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.
The different packaging technologies considered in the market report are 3D IC, 2.5D IC, and 2D IC.
Copper pillar, solder bumping, and gold bumping, among others, are the various bumping technologies included in the market report.
The significant industry verticals considered in the market report are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.
The major players in the market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
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