The 5G PCB market size reached around USD 20.35 Billion in 2023. The market is projected to grow at a CAGR of 14.70% between 2024 and 2032 to reach nearly USD 69.93 Billion by 2032.
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Historical Year
Forecast Year
As of 2020, there are approximately 26.66 billion active Internet of Things (IoT) devices worldwide. Statistics indicate that at least 127 new IoT devices are being connected to the internet every second. Moreover, experts anticipate that by 2025, the number of IoT devices connected to the web will exceed 75 billion. The increasing demand for IoT devices significantly contributes to the 5G PCB market value. IoT devices, which encompass smart home technologies, wearables, and industrial sensors, depend on 5G networks for optimal performance, particularly due to the substantial data they generate. This rising demand for connectivity necessitates the development of advanced 5G PCBs capable of managing higher frequencies and ensuring seamless communication across an extensive network of IoT devices. Therefore, the expansion of IoT is directly driving the need for 5G-enabled PCBs to support these technological advancements.
As per the 5G PCB market analysis, the advancement of 5G infrastructure is crucial to the growing demand for 5G printed circuit boards (PCBs). As telecom companies and government agencies invest in the development and improvement of 5G networks, there is an increasing need for advanced printed circuit boards that can support high-speed data transmission and handle higher frequencies. These PCBs are vital for the efficient functioning of 5G base stations, antennas, routers, and other network equipment. The global rollout of 5G technology greatly fuels the demand for specialised, high-performance PCBs.
Value in USD Billion
2024-2032
5G PCB Market Outlook
*this image is indicative*
The 5G PCB market growth can be attributed to the development of 5G infrastructure, growing demand for high-speed connectivity, and the expansion of IOT devices.
The increasing need for faster internet speeds and seamless communication drives the adoption of 5G technology, leading to a greater demand for advanced printed circuit boards (PCBs) that support the infrastructure required for 5G networks.
The rapid growth of Internet of Things (IoT) devices, which rely on 5G for quick and efficient communication, is boosting growth of the 5G PCB market, thereby facilitating the development and deployment of interconnected smart devices worldwide.
The shift in the automotive sector towards autonomous vehicles and advanced driver assistance systems (ADAS), which require high-speed communication, increases the need for 5G PCBs to ensure reliable, high-performance connectivity in modern vehicles.
The development of smart cities, which depend on 5G for real-time data processing and communication is driving the demand for 5G PCBs that offer effective, scalable, and secure solutions for urban infrastructure.
A major trend contributing to market expansion is the increasing demand for high-speed, low-latency connectivity, particularly in sectors like telecommunications, the Internet of Things (IoT), and automotive. As 5G networks evolve, the need for advanced PCBs capable of handling higher frequencies and enabling faster data transmission becomes more essential. Furthermore, innovations in PCB materials, such as the use of high-frequency laminates and integrated technologies, are leading to more efficient and compact designs. Additionally, the growing number of IoT devices and government investments in 5G infrastructure are driving growth of the market.
The EMR’s report titled “Global 5G PCB Market Report and Forecast 2024-2032” offers a detailed analysis of the market based on the following segments:
Breakup by PCB Type
Breakup by Substrate
Breakup by Region
Based on the region, the market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. Regions like Asia Pacific and Latin America are projected to grow at a CAGR of 16.5% and 15.9% during the forecast period of 2024-2032.The growing demand for 5G PCBs in these regions is driven by the rapid expansion of 5G infrastructure and the rising adoption of advanced telecommunications technologies.
Market players are focusing on the adoption of technological advancements to gain a competitive edge in the market and to improve the 5G PCB market outlook.
Headquartered in Osaka, Japan, Panasonic Holdings Corp. was founded in 1918. The company is a global leader in electronics, offering products and solutions across a wide range of sectors, including automotive, home appliances, and industrial technology.
Founded in 1996 and based in Taoyuan, Taiwan, Tripod Technology Corporation specialises in high-performance pr...
Established in 1992 and headquartered in Shenzhen, China, Xinfeng Huihe Circuits Co., Ltd. is a leading manufa...
Founded in 1979 and headquartered in Taoyuan, Taiwan, Chin Poon Industrial Co., Ltd. is a prominent PCB manufa...
*Please note that this is only a partial list; the complete list of key players is available in the full report. Additionally, the list of key players can be customized to better suit your needs.*
Other major players included in the 5G PCB market report are Shennan Circuits Co., Ltd., WUS Printed Circuit Co., Ltd., Zhen Ding Technology Holding Limited, Hannstar Board Co., Ltd., Kinsus Interconnect Technology Corp., and Compeq Manufacturing Co. Ltd., among others.
*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*
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In 2023, the market attained a value of nearly USD 20.35 Billion.
The market is assessed to grow at a CAGR of 14.70% between 2024 and 2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 69.93 Billion by 2032.
Major drivers of the market are the growing demand for high-speed connectivity and expansion of IOT devices.
As per the EMR report, the different substrates of 5G PCB are rigid, flexible, and rigid-flexible.
The major regions considered in the market are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
Major players in the market are Panasonic Holdings Corp., Tripod Technology Corporation, Xinfeng Huihe Circuits Co., Ltd., Chin Poon Industrial Co., Ltd., Shennan Circuits Co., Ltd., WUS Printed Circuit Co., Ltd., Zhen Ding Technology Holding Limited, Hannstar Board Co., Ltd., Kinsus Interconnect Technology Corp., and Compeq Manufacturing Co. Ltd., among others.
Explore our key highlights of the report and gain a concise overview of key findings, trends, and actionable insights that will empower your strategic decisions.
| REPORT FEATURES | DETAILS |
| Base Year | 2023 |
| Historical Period | 2018-2023 |
| Forecast Period | 2024-2032 |
| Scope of the Report |
Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:
|
| Breakup by PCB Type |
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| Breakup by Substrate |
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| Breakup by Region |
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| Market Dynamics |
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| Competitive Landscape |
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| Companies Covered |
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193/26/4 St.no.6, Ward Binh Hung Hoa, Binh Tan District, Ho Chi Minh City
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United States (Head Office)
30 North Gould Street, Sheridan, WY 82801
+1-415-325-5166
Australia
63 Fiona Drive, Tamworth, NSW
+61-448-061-727
India
C130 Sector 2 Noida, Uttar Pradesh 201301
+91-858-608-1494
Philippines
40th Floor, PBCom Tower, 6795 Ayala Avenue Cor V.A Rufino St. Makati City, 1226.
+63-287-899-028, +63-967-048-3306
United Kingdom
6 Gardner Place, Becketts Close, Feltham TW14 0BX, Greater London
+44-753-713-2163
Vietnam
193/26/4 St.no.6, Ward Binh Hung Hoa, Binh Tan District, Ho Chi Minh City
+84-865-399-124
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